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to our customers, old company name in catalogs and other documents on april 1 st , 2010, nec electronics corporation merged with renesas technology corporation, and renesas electronics corporation took over all the business of both companies. therefore, although the old company name remains in this document, it is a valid renesas electronics document. we appreciate your understanding. renesas electronics website: http://www.renesas.com april 1 st , 2010 renesas electronics corporation issued by: renesas electronics corporation (http://www.renesas.com) send any inquiries to http://www.renesas.com/inquiry.
notice 1. all information included in this document is current as of the date this document is issued. such information, however, is subject to change without any prior notice. before purchasing or using any renesas el ectronics products li sted herein, please confirm the latest product information with a renesas electronics sales office. also , please pay regular and careful attention to additional and different information to be disclosed by rene sas electronics such as that disclosed through our website. 2. renesas electronics does not assume any liability for infringeme nt of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electroni cs products or techni cal information descri bed in this document . no license, express, implied or otherwise, is granted hereby under any patents, copyri ghts or other intell ectual property right s of renesas electronics or others. 3. you should not alter, modify, copy, or otherwise misappropriate any re nesas electronics product, wh ether in whole or in part . 4. descriptions of circuits, software and other related informat ion in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully re sponsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. when exporting the products or technology described in this doc ument, you should comply with the applicable export control laws and regulations and follow the proc edures required by such laws and re gulations. you should not use renesas electronics products or the technology described in this docum ent for any purpose relating to mil itary applicati ons or use by the military, including but not l imited to the development of weapons of mass de struction. renesas electronics products and technology may not be used for or incor porated into any products or systems whose manufacture, us e, or sale is prohibited under any applicable dom estic or foreign laws or regulations. 6. renesas electronics has used reasonable care in preparing th e information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. renesas electronics products ar e classified according to the following three quality grades: ?standard?, ?high quality?, an d ?specific?. the recommended applications for each renesas electronics product de pends on the product?s quality grade, as indicated below. you must check the qua lity grade of each renesas electronics pr oduct before using it in a particular application. you may not use any renesas electronics produc t for any application categorized as ?speci fic? without the prior written consent of renesas electronics. further, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. re nesas electronics shall not be in any way liable for any damages or losses incurred by you or third partie s arising from the use of any renesas electronics product for a n application categorized as ?specific? or for which the product is not intende d where you have failed to obtain the prior writte n consent of renesas electronics. the quality grade of each renesas electronics product is ?standard? unless otherwise expressly specified in a renesas electr onics data sheets or data books, etc. ?standard?: computers; office equipmen t; communications e quipment; test and measurement equipment; audio and visual equipment; home electronic a ppliances; machine tools; personal electronic equipmen t; and industrial robots. ?high quality?: transportation equi pment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti- crime systems; safety equipment; and medical equipment not specif ically designed for life support. ?specific?: aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support device s or systems), surgical im plantations, or healthcare intervention (e.g. excision, etc.), and any other applicati ons or purposes that pose a di rect threat to human life. 8. you should use the renesas electronics pr oducts described in this document within the range specified by renesas electronics , especially with respect to the maximum ra ting, operating supply voltage range, movement power volta ge range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions o r damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its produc ts, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate a nd malfunctions under certain use conditions. fur ther, renesas electronics products are not subject to radiation resistance design. please be sure to implement safety measures to guard them against the possibility of physic al injury, and injury or damage caused by fire in the event of the failure of a renesas electronics product, such as safe ty design for hardware and software in cluding but not limited to redundancy, fire control and malfunction prevention, appropri ate treatment for aging degradation or an y other appropriate measures. because the evaluation of microcomputer software alone is very difficult , please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesa s electronics sales office for details as to environmental matters such as the environmental compatibility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regul ate the inclusion or use of c ontrolled substances, including wi thout limitation, the eu rohs directive. renesas electronics assumes no liability for damage s or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any form, in w hole or in part, without prio r written consent of renes as electronics. 12. please contact a renesa s electronics sales office if you have any questi ons regarding the informat ion contained in this document or renesas electroni cs products, or if you have any other inquiries. (note 1) ?renesas electronics? as used in this document means renesas electronics corporation and also includes its majority- owned subsidiaries. (note 2) ?renesas electronics product(s)? means any product developed or manufactured by or for renesas electronics.
caution observe precautions when handling because these devices are sensitive to electrostatic discharge. the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. document no. pu10752ej01v0ds (1st edition) date published april 2009 ns printed in japan silicon power mos fet ne5531079a 7.5 v operation silicon rf power ldmos fet for uhf-band 10 w transmission amplifiers data sheet 2009 description the ne5531079a is an n-channel silicon pow er laterally diffused mos fet specially designed as the transmission power amplifier for 7.5 v radio systems. dies are m anufactured using our newmos-m1 technology and housed in a surface mount package. this device can deliver 40.0 dbm output power wit h 68% power added efficiency at 460 mhz under the 7.5 v supply voltage. features ? high output power : p out = 40.0 dbm typ. (v ds = 7.5 v, i dset = 200 ma, f = 460 mhz, p in = 25 dbm) ? high power added efficiency : add = 68% typ. (v ds = 7.5 v, i dset = 200 ma, f = 460 mhz, p in = 25 dbm) ? high linear gain : g l = 20.5 db typ. (v ds = 7.5 v, i dset = 200 ma, f = 460 mhz, p in = 10 dbm) ? surface mount package : 5.7 5.7 1.1 mm max. ? single supply : v ds = 7.5 v max. applications ? 460 mhz band radio systems ? 900 mhz band radio systems ordering information part number order number package marking supplying form ne5531079a NE5531079A-A 79a (pb-free) w5 ? 12 mm wide embossed taping ? gate pin face the perforation side of the tape ne5531079a-t1 ne5531079a-t1-a ? 12 mm wide embossed taping ? gate pin face the perforation side of the tape ? qty 1 kpcs/reel ne5531079a-t1a ne5531079a-t1a-a ? 12 mm wide embossed taping ? gate pin face the perforation side of the tape ? qty 5 kpcs/reel remark to order evaluation samples, pleas e contact your nearby sales office. part number for sample order: ne5531079a
data sheet pu10752ej01v0ds 2 ne5531079a absolute maximum ratings (t a = +25 c) operation in excess of any one of these parameters may result in permanent damage. parameter symbol ratings unit drain to source voltage v ds note 1 30 v gate to source voltage v gs 6.0 v drain current i ds 3.0 a drain current (pulse test) i ds note 2 6.0 a total power dissipation p tot 35 w channel temperature t ch 125 c storage temperature t stg ? 55 to +125 c note 1. v ds will be used under 12 v on rf operation. 2. duty cycle 50%, t on 1 s recommended operating conditions parameter symbol test conditions min. typ. max. unit drain to source voltage v ds ? 6.0 7.5 v gate to source voltage v gs 1.15 1.55 2.05 v drain current i ds ? 2.0 ? a input power p in f = 460 mhz, v ds = 6.0 v ? 25 30 dbm electrical characteristics (t a = +25 c, unless otherwise specified, usi ng our standard test fixture) parameter symbol test conditions min. typ. max. unit gate to source leakage current i gss v gs = 6.0 v ? ? 100 na drain to source leakage current (zero gate voltage drain current) i dss v ds = 25 v ? ? 10 na gate threshold voltage v th v ds = 7.5 v, i ds = 1.0 ma 0.8 1.15 1.55 v thermal resistance r th channel to case ? 2.9 ? c/w transconductance g m v ds = 7.5 v, i ds = 700 100 ma 2.5 3.2 4.0 s drain to source breakdown voltage bv dss i dss = 10 a 25 35 ? v output power p out f = 460 mhz, v ds = 7.5 v, 39.0 40.0 ? dbm drain current i ds p in = 25 dbm, ? 2.0 ? a power added efficiency add i dset = 200 ma (rf off) ? 68 ? % linear gain g l note ? 20.5 ? db note p in = 10 dbm dc performance is 100% testing. rf performanc e is testing several samples per wafer. wafer rejection criteria for standard devic es is 1 reject for several samples.
data sheet pu10752ej01v0ds 3 ne5531079a test circuit (f = 460 mhz) 123 nh rfout c20 27 pf c10 10 pf c11 24 pf c2 1 000 pf c21 1.8 pf c22 100 pf 1 f 50 4.7 k rfin c1 1 f c1 v gs v ds r1 150 r2 l1 50 the application circuits and their parameters are for reference only and are not intended for use in actual design-ins. components of test circuit for me asuring electrical characteristics symbol value type maker c1 1 f grm31cr72a105ka01b murata c2 1 000 pf grm1882c1h102ja01 murata c10 10 pf grm1882c1h100ja01 murata c11 24 pf atc100a240jw american technical ceramics c20 27 pf atc100a270jw american technical ceramics c21 1.8 pf atc100a1r8bw american technical ceramics c22 100 pf atc100a101jw american technical ceramics r1 4.7 k 1/8w chip resistor ? r2 150 1/8w chip resistor ? l1 123 nh 0.5 mm, d = 3 mm, 10 turns ohesangyou pcb ? r4775, t = 0.4 mm, r = 4.5, size = 30 48 mm ?
data sheet pu10752ej01v0ds 4 ne5531079a illustration of the test circuit assembled on evaluation board c1 c11 c10 c2 c1 c20 l1 r1 r2 c21 c22 in out using the nec evaluation board symbol value c1 1 f c2 1 000 pf c10 10 pf c11 24 pf c20 27 pf c21 1.8 pf c22 100 pf r1 4.7 k r2 150 l1 123 nh
data sheet pu10752ej01v0ds 5 ne5531079a typical characteristics (t a = +25 c, id set = 200 ma, unless otherwise specified) 3rd/5th order intermodulation distortion im 3 /im 5 (dbc) 2 tones output power p out (dbm) im 3 /im 5 vs. 2 tones output power im 3 im 5 2nd harmonics 2f 0 (dbc) 3rd harmonics 3f 0 (dbc) output power p out (dbm) 2f 0 , 3f 0 vs. output power f = 460 mhz p out i ds output power p out (dbm) drain current i ds (a) input power p in (dbm) output power, drain current vs. input power 45 40 35 30 25 20 15 10 5 0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 35 30 20 15 10 ? 5 05 25 v ds = 3.6 v 4.5 v 6.0 v 7.5 v add power gain g p (db) power added efficiency add (%) input power p in (dbm) power gain, power added efficiency vs. input power f = 460 mhz 40 35 30 25 20 15 10 5 0 80 70 60 50 40 30 20 10 0 35 30 20 15 10 ? 5 05 25 v ds = 3.6 v 4.5 v 6.0 v 7.5 v g p f = 460 mhz 0 ? 10 ? 20 ? 30 ? 40 ? 50 ? 60 ? 70 40 35 30 1 5 20 25 45 v ds = 3.6 v 4.5 v 6.0 v 7.5 v f1 = 460 mhz f2 = 461 mhz 0 ? 10 ? 20 ? 30 ? 40 ? 50 ? 60 ? 70 35 30 25 1 0 15 20 40 v ds = 3.6 v 4.5 v 6.0 v 7.5 v 2f 0 3f 0 remark the graphs indicate nominal characteristics.
data sheet pu10752ej01v0ds 6 ne5531079a s-parameters s-parameters and noise parameters are provided on our web site in a format (s2p) that enables the direct import of the parameters to microwave circuit simulators without the need for keyboard inputs. click here to download s-parameters. [rf and microwave] [device parameters] url http://www.necel.com/microwave/en/
data sheet pu10752ej01v0ds 7 ne5531079a package dimensions 79a (unit: mm) 0.90.2 0.20.1 0.40.15 5.7 max. 5.7 max. 0.60.15 0.80.15 4.4 max. 4.2 max. source gate drain (bottom view) 3.60.2 1.50.2 1.2 max. 0.8 max. 1.0 max. source gate drain w 5 21001 79a package recommended p.c.b. layout (unit: mm) 1.7 4.0 0.5 1.0 5.9 1.2 gate source drain 0.5 6.1 0.5 through hole: 0.2 33 stop up the hole with a rosin or something to avoid solder flow.
data sheet pu10752ej01v0ds 8 ne5531079a recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recomm ended below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 c or below time at peak temperature : 10 seconds or less time at temperature of 220 c or higher : 60 seconds or less preheating time at 120 to 180 c : 120 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below ir260 wave soldering peak temperature (molten solder temperature) : 260 c or below time at peak temperature : 10 seconds or less preheating temperature (package surface temperature) : 120 c or below maximum number of flow processes : 1 time maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below ws260 partial heating peak temperature (pin temperature) : 350 c or below soldering time (per pin of device) : 3 seconds or less maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below hs350-p3 caution do not use different soldering met hods together (except for partial heating).
ne5531079a the information in this document is current as of april, 2009. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorpor ate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) ? ? ? ? ? ? m8e 02. 11-1 (1) (2) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "standard": "special": "specific":

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